2007492-5

TE Connectivity
571-2007492-5
2007492-5

Herst.:

Beschreibung:
E/A-Steckverbinder SFP+ASSY 2X1 SPRING FINGERS 4LP SN

ECAD Model:
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Auf Lager: 109

Lagerbestand:
109 sofort lieferbar
Lieferzeit ab Hersteller:
4 Wochen Geschätzte Produktionszeit des Werks für Mengen, die größer als angezeigt sind.
Minimum: 1   Vielfache: 1
Stückpreis:
CHF -.--
Erw. Preis:
CHF -.--
Vorauss. Zolltarif:

Preis (CHF)

Menge Stückpreis
Erw. Preis
CHF 22.04 CHF 22.04
CHF 20.05 CHF 200.50
CHF 16.63 CHF 415.75
CHF 15.60 CHF 1 684.80
CHF 15.53 CHF 3 913.56
CHF 15.06 CHF 7 590.24
1 008 Kostenvoranschlag

Produktattribut Attributwert Attribut auswählen
TE Connectivity
Produktkategorie: E/A-Steckverbinder
RoHS:  
Connectors
Gold
Through Hole
Press Fit
Right Angle
SFP+
Bulk
Zubehörart: Cage Assembly, 2x1 Stacked
Marke: TE Connectivity
Farbe: Black
Kontaktmaterial: Copper Alloy
Land der Bestückung: Not Available
Land der Verbreitung: Not Available
Ursprungsland: CN
Entflammbarkeitseinstufung: UL 94 V-0
Gehäusematerial: Liquid Crystal Polymer (LCP)
Anzahl der Ports: 2 Port
Produkt-Typ: I/O Connectors
Verpackung ab Werk: 36
Unterkategorie: I/O Connectors
Typ: SFP
Gewicht pro Stück: 21.772 g
Produkte gefunden:
Um ähnliche Produkte anzuzeigen, wählen Sie mindestens ein Kontrollkästchen aus
Um ähnliche Produkte in dieser Kategorie anzuzeigen, wählen Sie mindestens ein Kontrollkästchen oben aus.
Ausgewählte Attribute: 0

CNHTS:
8536901100
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
BRHTS:
85366990
ECCN:
EAR99

TE Connectivity SFP+ I/O

TE Connectivity's SFP+ product family extends the use of the Small Form-Factor Pluggable (SFP) interconnect up to 10Gb/s. This system meets the performance requirements of SFF (Small Form-Factor) specification SFF-8431 and supports 8G Fiber Channel and 10G Ethernet applications. The SFP+ product family includes cages, connectors, and copper cable assemblies.
Learn More

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.