|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
10.04 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM40015L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
10.04 CHF
|
|
|
9.80 CHF
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
10.04 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM40015L042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
10.04 CHF
|
|
|
9.80 CHF
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
10.55 CHF
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40015S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
10.55 CHF
|
|
|
10.28 CHF
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
10.55 CHF
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM40015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
10.55 CHF
|
|
|
10.28 CHF
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
18.73 CHF
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM50010S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
|
18.73 CHF
|
|
|
18.26 CHF
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
18.73 CHF
-
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
Mouser-Teilenr.
200-LPAM50010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
|
|
18.73 CHF
|
|
|
18.26 CHF
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
21.27 CHF
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM50015S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-S-04-2-K-TR
- Samtec
-
650:
4.65 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF10035S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
4.65 CHF
|
|
|
4.54 CHF
|
|
Min.: 650
Mult.: 650
:
650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-06-1-K-TR
- Samtec
-
550:
6.11 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF20030L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-08-2-K-TR
- Samtec
-
325:
9.75 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF20035S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
9.75 CHF
|
|
|
9.50 CHF
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-S-06-2-K-TR
- Samtec
-
550:
7.63 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF30030S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 550
Mult.: 550
:
550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-06-2-K-TR
- Samtec
-
500:
9.44 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF40035L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-L-08-1-K-TR
- Samtec
-
325:
14.05 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF40035L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
14.05 CHF
|
|
|
13.71 CHF
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.5-S-04-1-K-TR
- Samtec
-
500:
8.36 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAF40035S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
Min.: 500
Mult.: 500
:
500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-L-08-2-K-TR
- Samtec
-
1:
11.43 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM10010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
11.43 CHF
|
|
|
10.93 CHF
|
|
|
10.51 CHF
|
|
|
9.75 CHF
|
|
|
7.12 CHF
|
|
|
Anzeigen
|
|
|
8.36 CHF
|
|
|
7.12 CHF
|
|
|
6.94 CHF
|
|
Min.: 1
Mult.: 1
:
400
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-10-01.0-S-06-1-K-TR
- Samtec
-
400:
6.90 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM10010S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
6.90 CHF
|
|
|
6.56 CHF
|
|
Min.: 400
Mult.: 400
:
400
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-2-K-TR
- Samtec
-
300:
9.83 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM20010L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
9.83 CHF
|
|
|
9.59 CHF
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-S-08-2-K-TR
- Samtec
-
300:
10.34 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM20010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
10.34 CHF
|
|
|
10.09 CHF
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-20-01.5-L-08-2-K-TR
- Samtec
-
1:
16.12 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM20015L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
16.12 CHF
|
|
|
15.41 CHF
|
|
|
14.83 CHF
|
|
|
13.74 CHF
|
|
|
10.04 CHF
|
|
|
Anzeigen
|
|
|
11.80 CHF
|
|
|
9.80 CHF
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-L-06-1-K-TR
- Samtec
-
325:
9.18 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM30010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
9.18 CHF
|
|
|
8.94 CHF
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-06-1-K-TR
- Samtec
-
1:
15.02 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM30015L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
15.02 CHF
|
|
|
14.37 CHF
|
|
|
13.83 CHF
|
|
|
12.82 CHF
|
|
|
9.37 CHF
|
|
|
Anzeigen
|
|
|
11.01 CHF
|
|
|
9.14 CHF
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
15.24 CHF
-
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
Mouser-Teilenr.
200-LPAM40015L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 14 Wochen
|
|
|
15.24 CHF
|
|
|
14.86 CHF
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-04-1-K-TR
- Samtec
-
Beschränkte Verfügbarkeit
-
Neues Produkt
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Mouser-Teilenr.
200-LPAF1003.5L041K
Neues Produkt
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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Nein
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LPAF
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Reel
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-08-1-K-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-LPAF2003.0L081K
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
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Nein
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LPAF
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Reel
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Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-20-01.0-L-08-1-K-TR
- Samtec
-
Beschränkte Verfügbarkeit
|
Mouser-Teilenr.
200-LPAM2001.0L081K
|
Samtec
|
Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
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Nein
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LPAM
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Reel
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