SEAF-RA Serie Platine-zu-Platine & Mezzanine-Steckverbinder

Ergebnisse: 325
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Stackhöhe Nennstrom Nennspannung Maximale Datenrate Minimale Betriebstemperatur Maximale Betriebstemperatur Kontaktüberzug Kontaktmaterial Gehäusematerial Serie Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 100
Mult.: 100
: 100
Nein
Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 50 Wochen
Min.: 1
Mult.: 1
: 125
Nein
Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 100
Mult.: 100
: 100
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM SEARAY HS ARRAY SCKT Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 100
Mult.: 100
: 100

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 100
Mult.: 100
: 100
Nein
Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 100
Mult.: 100
: 100
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 36 Wochen
Min.: 1
Mult.: 1
: 75
Nein
Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 45 Wochen
Min.: 1
Mult.: 1
: 175
Nein
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 125
Mult.: 125
: 125
Nein
Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 1
Mult.: 1
: 100
Nein
Connectors 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 52 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Connectors 300 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 175
Mult.: 175
: 175
Nein
Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 150
Mult.: 150
: 150
Nein
Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 100
Mult.: 100
: 100
Nein
Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Connectors 240 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 175
Mult.: 175
: 175
Nein
Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 14 Wochen
Min.: 100
Mult.: 100
: 100
Nein
Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Right Angle 7 mm 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 13 Wochen
Min.: 75
Mult.: 75
: 75
Nein
Connectors 240 Position 1.27 mm (0.05 in) 8 Row Solder Right Angle 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Socket Nicht-auf-Lager-Vorlaufzeit 19 Wochen
Min.: 225
Mult.: 225
: 225
Nein
Connectors 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.7 A 240 VAC - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) SEAF-RA Reel