congatec Embedded Lösungen

Computer-On-Module - COM COM-HPC Client module based on Intel Core i9-13900E LGA 1700 processor

Computer-On-Module - COM COM-HPC Client module based on Intel Core i3-12100E LGA 1700 processor with 4 P-cores 3.2GHz up to 4.2GHz, 12MB Intel Smart Cache, Intel UHD Graphics 730 with 24EUs, Dual channel DDR5 3600MT/s memory interface, Chipset Q680E, Intel code name: Al

Computer-On-Module - COM COM-HPC Size D module based on Intel Xeon D1735TR 8-core processor with tbd GHz, 15MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.

Computer-On-Module - COM COM-HPC Size D module based on Intel Xeon D1746TER 10-core processor with tbd GHz, 15MB cache and dual channel DDR4 2400 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range.

Computer-On-Module - COM COM-HPC Size D module based on Intel Xeon D1732TE 8-core processor with 1.9 GHz, 15MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range.

Computer-On-Module - COM COM-HPC Size A module based on Intel Core i3-12300HE processor with 4 P-cores 1.9GHz up to 4.3GHz and 4 E-cores 1.5GHz up to 3.3GHz, 12MB Intel Smart Cache, Intel UHD Graphics with 48EUs, Dual channel DDR5 4800 MT/s memory interface, Intel code

Computer-On-Module - COM COM-HPC Size A module based on Intel Core i7-12800HE processor with 6 P-cores 2.4GHz up to 4.6GHz and 8 E-cores 1.8GHz up to 3.5GHz, 24MB Intel Smart Cache, Intel Iris Xe Graphics architecture with 96 EUs, Dual channel DDR5 4800 MT/s memory inter

Computer-On-Module - COM COM-HPC Client module based on Intel Core i9-12900E LGA 1700 processor with 8 P-cores 2.3GHz up to 5.0GHz and 8 E-cores 1.7GHz up to 3.8GHz, 30MB Intel Smart Cache, Intel UHD Graphics 770 with 32EUs, Dual channel DDR5 3600MT/s memory interface, C

Computer-On-Module - COM COM-HPC Size D module based on Intel Xeon D1715TER 4-core processor with 2.4 GHz, 10MB cache and dual channel DDR4 up to 2933 MT/s memory interface (formerly Ice Lake-D LCC). Industrial temperature range.

Entwicklungsboards und Kits - ARM Evaluation carrier board for Qseven 2.0 ARM based modules.

Computer-On-Module - COM Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM Cortex-A53 @1.8GHz +1x ARM Cortex-M7 + NPU, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial grade temperature range from 0 C to 60 C.

Computer-On-Module - COM SMARC 2.1 module with Intel Atom x6425RE quad core processor with 1.9GHz core frequency, 1.5MB cache, 4GB 4267MT/s LPDDR4x onboard memory and 32GB eMMC onboard flash. Industrial grade temperature range from -40 C to 85 C.