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Chip Quik CQB Gold Bonding Wires

02.07.2025

- High-purity gold >99.99% is designed specifically for wire bonding.

12.27.2024

- Designed using high-quality synthetic flux and precision atomized metal powder.

Chip Quik Solder Wire

02.12.2024

- Available in various flux-core options and numerous alloy configurations.

09.06.2023

- Manufactured from virgin materials to meet or exceed the requirements of a building.

09.05.2023

- Features 11.9N/mm2 (at 20°C) tensile strength and 118°C (244°F) melting point.

Chip Quik Solder Wires

03.21.2023

- Metal alloys with more than 12 months of shelf life.

03.20.2023

- Featuring a 0.76mm diameter and a 183°C to 188°C melting point range.

05.26.2022

- 100% continuous flux core with no air inclusions & pure first metal melting for long-term results.

05.20.2022

- No-clean 63/37 non-recycled leaded solder paste.

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