SEAMP Serie Platine-zu-Platine & Mezzanine-Steckverbinder

Ergebnisse: 112
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Nennstrom Nennspannung Minimale Betriebstemperatur Maximale Betriebstemperatur Kontaktüberzug Kontaktmaterial Gehäusematerial Serie Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 66Auf Lager
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 28Auf Lager
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 23Auf Lager
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 60Auf Lager
Min.: 1
Mult.: 1

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 4Auf Lager
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 31Auf Lager
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 5Auf Lager
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM SEARAY HS HD ARRAY 26Auf Lager
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 4Auf Lager
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Pin Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 32Auf Lager
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM SEARAY HS HD ARRAY TERM 7Auf Lager
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM SEARAY HS HD ARRAY TERM 1Auf Lager
Min.: 1
Mult.: 1

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 1Auf Lager
Min.: 1
Mult.: 1

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 19Auf Lager
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal 64Ab Werk erhältlich
Min.: 1
Mult.: 1

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 125
Mult.: 125
: 125

Headers 40 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 200
Mult.: 200
: 200

Headers 80 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 125
Mult.: 125
: 125

Headers 120 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 125
Mult.: 125
: 125

Headers 160 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 125
Mult.: 125
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 125
Mult.: 125
: 125

Headers 180 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 125
Mult.: 125
: 125

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 100
Mult.: 100
: 100

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 125
Mult.: 125
: 125

Headers 120 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 125
Mult.: 125
: 125

Headers 240 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel