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HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package
- DA14531-00000FX2
- Renesas / Dialog
-
1:
CHF 1.79
-
15 754Auf Lager
|
Mouser-Teilenr.
724-DA14531-00000FX2
|
Renesas / Dialog
|
HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOsin FCGQFN24 and 0.4mm ball pitch package
|
|
15 754Auf Lager
|
|
|
CHF 1.79
|
|
|
CHF 1.54
|
|
|
CHF 1.46
|
|
|
CHF 1.35
|
|
|
Anzeigen
|
|
|
CHF 0.907
|
|
|
CHF 1.27
|
|
|
CHF 1.19
|
|
|
CHF 0.989
|
|
|
CHF 0.932
|
|
|
CHF 0.907
|
|
Min.: 1
Mult.: 1
:
4 000
|
|
|
Bluetooth
|
ARM Cortex M0+
|
2.4 GHz
|
|
2.5 dBm
|
- 94 dBm
|
1.1 V
|
3.3 V
|
2.2 mA
|
3.5 mA
|
32 kB, 144 kB
|
- 40 C
|
+ 85 C
|
FCGQFN-24
|
Reel, Cut Tape, MouseReel
|
|
|
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HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOsin WL-CSP17 and 0.5mm ball pitch package
- DA14531-00000OG2
- Renesas / Dialog
-
1:
CHF 1.65
-
5 807Auf Lager
|
Mouser-Teilenr.
724-DA14531-00000OG2
|
Renesas / Dialog
|
HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOsin WL-CSP17 and 0.5mm ball pitch package
|
|
5 807Auf Lager
|
|
|
CHF 1.65
|
|
|
CHF 1.42
|
|
|
CHF 1.36
|
|
|
CHF 1.24
|
|
|
Anzeigen
|
|
|
CHF 0.907
|
|
|
CHF 1.18
|
|
|
CHF 1.11
|
|
|
CHF 0.999
|
|
|
CHF 0.961
|
|
|
CHF 0.907
|
|
Min.: 1
Mult.: 1
:
4 000
|
|
|
Bluetooth
|
ARM Cortex M0+
|
2.4 GHz
|
|
2.5 dBm
|
- 94 dBm
|
1.1 V
|
3.3 V
|
2.2 mA
|
3.5 mA
|
32 kB, 144 kB
|
- 40 C
|
+ 85 C
|
WLCSP-17
|
Reel, Cut Tape
|
|
|
|
HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
Renesas / Dialog DA14531-01000FX2
- DA14531-01000FX2
- Renesas / Dialog
-
4 000:
CHF 0.891
-
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
Mouser-Teilenr.
968-DA14531-01000FX2
|
Renesas / Dialog
|
HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 12 GPIOs in FCGQFN24 and 0.4mm ball pitch package
|
|
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
|
Min.: 4 000
Mult.: 4 000
:
4 000
|
|
|
Bluetooth 5.1
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
2.5 dBm
|
- 94 dBm
|
1.8 V
|
3.6 V
|
2.2 mA
|
3.5 mA
|
32 kB
|
- 40 C
|
+ 85 C
|
FCGQFN-24
|
Reel
|
|
|
|
HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package
Renesas / Dialog DA14531-01000OG2
- DA14531-01000OG2
- Renesas / Dialog
-
4 000:
CHF 0.826
-
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
Mouser-Teilenr.
968-DA14531-01000OG2
|
Renesas / Dialog
|
HF-System auf einem Chip - SoC Bluetooth Low Energy 5.1 SoC with integrated ARM Cortex M0+, memories and peripherals ? 6 GPIOs in WL-CSP17 and 0.5mm ball pitch package
|
|
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
|
|
Min.: 4 000
Mult.: 4 000
:
4 000
|
|
|
Bluetooth 5.1
|
ARM Cortex M0+
|
2.4 GHz
|
1 Mbps
|
2.5 dBm
|
- 94 dBm
|
1.8 V
|
3.6 V
|
2.2 mA
|
3.5 mA
|
32 kB
|
- 40 C
|
+ 85 C
|
WLCSP-17
|
Reel
|
|
Schweiz